二苯甲烷双马来酰亚胺

N,N'--4,4'--DIPHENYLMETHANE--BISMALEIMIDE

◆外观：浅黄色粉末

◆酸值：≤1.0 KOHmg/g

◆热甲苯溶解性：清澈透亮

◆杂质: ≤0.1%

◆GT凝胶化时间：<3min (200℃,1克样)

◆DSC数据: 聚合极限240℃±15℃; 聚合能 (△H)>200 J/g

◆固化物玻璃化温度Tg: 340℃ (280℃/10 h固化)

◆固化物开始热分解温度Td: 空气下开始失重温度500℃ (280℃/10 h固化)

本品能在高低温（—200℃～260℃）下赋予材料突出的机械性能、高电绝缘性、耐磨性、耐老化及防化学腐蚀、耐辐射性、高真空中的难挥发性以及优良的粘结性、耐湿热性和无油自润滑性，是多种高分子材料及新型橡胶的卓越改性剂，还可作为其它高分子化合物的交联剂、偶联剂和固化剂等。

BMI应用领域：多年来，被称为高温下万能塑料的聚胺——双马来酰亚胺亦日趋广泛地应用于高新技术的许多领域，主要有：一、电机绝缘材料 耐高温浸渍漆（溶剂型和无溶剂型）、漆包线漆、层压板、无纬带、云母带、电子覆铜板、模压塑料、环氧改性F~H级粉末涂料、浇铸件等；二、先进复合材料基体树脂 航天、航空结构材料、碳纤维耐高温结构件、高档印刷线路板和其它功能材料等；三、工程塑料 如聚丙烯PP、尼龙PA、ABS、APC、PVC、PBT、EPDM、PMMA等材料的增强改性剂（如在聚丙烯玻纤增强改性时加入<1%的BMI－01，即可使机械强度和马丁耐热提高一倍，效果显著)，还可用于新型橡胶硫化剂等；四、耐磨材料金刚石砂轮、重负荷砂轮、刹车片、耐高温轴承粘合剂、磁性材料等；五、其它方面 化肥生成（合成氨）机械设备的无油润滑、动静态密封材料等众多高新技术领域。 BMI作为制造耐热结构材料、H级或F级电气绝缘材料的一种比较理想的树脂基体，广泛用于航空、航天、电力、电子、计算机、通讯、汽车、铁路、建筑等工业领域。

N,N'-4,4'-Diphenylmethane--bismaleimide

Chemical Name: N,N’--4,4’—Diphenylmethane--bismaleimide(Short Form:BMI)

Molecular Formula: C21H14N2O4 Molecular Weight: 358.37Structural Formula: (1).Technical spec. of common type BMI－01: ▲Appearance: light yellow powder ▲M.P.: 150-157℃▲Acid Value: ≤3.0 KOHmg/g ▲Moisture: ≤1.0%▲Solubility in hot toluene: completely soluble ▲Impurity: ≤0.1%(2). Technical spec. of refined type BMI－01: ▲Appearance: light brilliant yellow powder ▲M.P.: 153-155℃▲Acid Value: ≤1.0 KOHmg/g ▲Moisture: ≤1.0%▲Solubility in hot toluene: completely soluble ▲Impurity: ≤0.1%▲GT (gelatinization time): <3min (200℃,1g sample)▲DSC data: limit of polymerization 240℃±15℃; polymerization energy(△H)>200 J/g▲Glass temperature of condensate, Tg: 340℃ (280℃/10 h solidifying)Thermal decomposition temp. of condensate, Td: weightlessness temp. in air: 500℃ (280℃/10 h solidifying)<2>Properties of BMI－01:1.Solubility: Soluble in dimethyl formamide, dimethyl acetamide, dimethyl sulfoxide etc.; partly soluble in acetone, dichloroethane and cresol. 2．Reactiveness:Can be copolymerized with many nucleophiles, such as amine, phenols, hydrogen sulphides and mercaptan. 3．Advantages of modified BMI-01: (1) Has similar viscoelasticity, rheological characteristic, moldability and workability to that of epoxy resins and thermosetting resins. (2)Won't release low-molecular volatile matter, and can used to make uniform heat-resistant materials and components without pores. (3)Has good compatibility with various fillers; has good wetting quality and ,adhesiveness with various fibers. (4)Good resistance to heat and moisture; low moisture absorption; can keep excellent mechanical property in dry, damp and high temperature (177－260℃) conditions. (5)Low factor of expansion, can achieve stable size of products. (6)Good resistance to radiation, low temperature, chemical reagents and wear. (7)Excellent dielectric property. (8)Lower price than polyimide.